PCB, PTH Plating Process
Product Application Guide
It is an electroless plating process to form Plated Through Hole (PTH) in PCB process.
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Director / Dong-jin Lee / +86-10-8954-7888 / djlee0117@hanmail.net
No. | Process | Explanation | Chemicals |
1 | Clean & Conditioner | Elimination of fine oxide film on copper surface | MS-C2000 |
2 | Rinse | ||
3 | Soft Etching | It improves plating adhesion by fine anchoring effect and surface area enlargement on board surface.Removal of oxide film and neutralization of residual Alkali | MS-C2100 |
4 | Rinse | ||
5 | Pre-Dip | Prevents water ingress into the bath, protects the catalyst, protects the Pd Provides wettability to facilitate adsorption. | MS-C2200 |
6 | Catalyst | MS-C2300 | |
7 | Rinse | Pd colloid adsorption | |
8 | Acclerator | MS-C2400 | |
9 | Rinse | ||
10 | E’less Cu | MS-C2500 | |
11 | MS-C2600 | ||
12 | |||
13 | Rinse | ||
14 | Electrolytic Plating or Image |