PCB, PTH Plating Process
Product Application Guide
It is an electroless plating process to form Plated Through Hole (PTH) in PCB process.
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Director / Dong-jin Lee / +86-10-8954-7888 / djlee0117@hanmail.net
| No. | Process | Explanation | Chemicals |
| 1 | Clean & Conditioner | Elimination of fine oxide film on copper surface | MS-C2000 |
| 2 | Rinse | ||
| 3 | Soft Etching | It improves plating adhesion by fine anchoring effect and surface area enlargement on board surface. Removal of oxide film and neutralization of residual Alkali | MS-C2100 |
| 4 | Rinse | ||
| 5 | Pre-Dip | Prevents water ingress into the bath, protects the catalyst, protects the Pd Provides wettability to facilitate adsorption. | MS-C2200 |
| 6 | Catalyst | MS-C2300 | |
| 7 | Rinse | Pd colloid adsorption | |
| 8 | Acclerator | MS-C2400 | |
| 9 | Rinse | ||
| 10 | E’less Cu | MS-C2500 | |
| 11 | MS-C2600 | ||
| 12 | |||
| 13 | Rinse | ||
| 14 | Electrolytic Plating or Image | ||