Plating process on Intenna parts, LDS
Products Application Guidance
Among the built-in Antenna parts, circuits formed by laser are sorted as LDS parts group. LDS processing method ,in addition to intenna products, has the merits on making construction surface of automobile airbag, hearing aid, connectors, and various foods of sensor small, lightweight, thin, and short of those whole products through forming the pattern by laser. As materials contain metal catalyst and the metal being activated by laser, plating process design needs full understanding about the materials.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
Reference
Electroless Nickel Sealing Solution SG-1
| No. | Process | Explanation | Chemicals |
| 1 | Ultrasonic Cleaning | MS MID Acid Clean | |
| 2 | Rinsing | ||
| 3 | Conditioner | Circuit Surface Adjustment | MS MID Conditioner |
| Alkali Etching Solution | MS S-32 | ||
| 4 | Rinsing | ||
| 5 | Strike | Activating the Circuit | MS MID Cu-70 Strike |
| 6 | Rinsing or Liquid Removing | ||
| 7 | Elctroless Copper Plating | Build Up 15㎛ | MS MID Cu-70 Build Up |
| 8 | Rinsing | ||
| 9 | Catalyst Treatment | Activator | MS MID ACT 100 |
| 10 | Rinsing | ||
| 11 | Electroless Nickel Plating | Mid,Low Phosphorous | MS MID EN-511 |
| Low Stress Nickel Alloy | MS MID ENW | ||
| Mid Phosphorous Shining | MS MID 211 Shining | ||
| High Phosphorous | MS MID 611 | ||
| Ni-B 60℃ Work | MS MID 811 | ||
| 12 | Rinsing | ||
| 13 | Replacement or Reducing Gold Plating | Option | MS MID Auroless Process |