Plating process on intenna parts, Dual Moulding
Products Application Guidance
Dual moulded circit built-in antenna parts. Usually PC materials are used for the primary infection and ABS resin is used for dual moulded circuit surface. Afterwards, it is necessary to change the process for SMD as high-termerature resin shall be applied for this process.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
Reference
Electroless Nickel Sealing Solution SG-1
| No. | Process | Explanation | Chemicals |
| 1 | Cleaning | MSPL Cleaner | |
| 2 | Liquid Removing | ||
| 3 | Etching | MS PL WA | |
| 4 | Rinsing | ||
| 5 | Restoration,Neutralization | Residual hexavalent chromium removal | |
| 6 | Rinsing | ||
| 7 | Pre-immersion | Pre-Dip | |
| 8 | Catalyst Treatment | Activator | MS SP200 |
| 9 | Rinsing | ||
| 10 | Accelerator | Accelerator | |
| 11 | Rinsing | ||
| 12 | Electroless Copper Plating | Strike | MS MID 70-Strike |
| 13 | Electroless Copper Plating | Build Up | MS MID 70-Build Up |
| 14 | Rinsing | ||
| 15 | Catalyst Treatment | Catalyst addition | MS MID ACT-100 |
| 16 | Rinsing | ||
| 12 | Electroless Nickel Plating | Mid Phosphorous Shining | MS MID 211 Shining |
| High Phosphorous | MS MID 611 | ||
| Ni-B 60℃ Work | MS MID 811 | ||
| 13 | Rinsing | ||
| 14 | Replacement or Reducing Gold Plating | Option | MS MID Auroless Process |