Electroless plating process on Powder.
Products Application Guidance
Coating Function-requiring metal on ceramic, resin, metal powder, CBN with 1~200 um diameter, It is essential to design the necessary facility for powder plating and know-how of plating process, how-to-manage.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
No. | Process | Explanation | Chemicals |
1 | Cleaning | MS-Clean | |
2 | Rinsing | ||
3 | Etching | Classification by material | MS Etching |
4 | Rinsing | ||
5 | Conditioner | Classification by material | MS Conditioner |
6 | Rinsing | ||
7 | Sensitizing or activating | MS ACT or SP-PD Process | |
8 | Rinsing | ||
9 | Accelerator | MS ACT Process | |
10 | Rinsing | ||
11 | Electroless Plating | Ni-P | MS 211/511 |
Ni-B | MS 811 | ||
Ni-P-W | MS ENW | ||
Ni-P-Co | MS Ni-Co | ||
Ag | MS Immersion Silver | ||
Sn | MS Immersion Tin | ||
Au | MS Auroless | ||
Cu | MS Cu-550 | ||
12 | Rinsing | ||
13 | Dry |