Plating process on forging copper products
Products Application Guidance
It is not easy to clean the surface of forging copper products. Therefore, the residing foreign substance elution in the high temperature environment weaken the plating sticking. Especially, high temperature reliability test, swelling failures are witnessed a lot. MS402 product provide with etching surface for the best plating condition. All the products satisfy RoHS regulations.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
No. | Process | Explanation | Chemicals |
1 | Deposition Cleaning | MS Clean 5000 | |
2 | Rinsing | ||
3 | Electrolysis Cleaning | MS Top Clean | |
4 | Rinsing | ||
5 | Etching | Forging defect area adjustment (Etching) | MS 402 |
6 | Rinsing | ||
7 | Activation | Desmut | |
8 | Rinsing | ||
9 | Electroless Plating | Strike in the tank | MS 211/411/511/611/811 |
10 | Rinsing | ||
11 | Sealing | Sealing | SG-1 |