MSC electroless nickel process introduction
Products Application Guidance
Following are Pre-treatment chemicals by materials, sort of electroless plating method by reducing agent, cobalt(Co) Tungsten(W) electroless alloy plating, and post treatment chemical. All the electroless nickel solutions do not contain any Pb, Cd that acceptable for RoHS regulations.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
No. | Process | Chemicals | character | Application field |
1 | Deposition / Electrolysis Cleaning | Top-Clean | Deposition-Electrolysis Cleaning | Steel and nonferrous metals |
2 | Immersion degreasing | MS A-Clean | No material corrosion | Aluminum and alloys |
3 | Alkali etching | MS A-22 | Alkali degreasing/Etching | Aluminum and alloys |
4 | Desmut | MS A111 | Si Desmut | Aluminum and alloys |
5 | Zincate | MS Zin-22 | Non cyanide Zincate | Aluminum and alloys |
6 | Zincate | MS Zin-500 | Ternary alloy Zincate | Aluminum and alloys |
7 | Alkali activator | MS Act500 | Surface adjustment and activation | Mo and Alloys |
8 | Catalyst treatment agent | MS PD200 | Catalyst activation | Mo and Alloys |
9 | Metal activator | MS PA-100 | Metal material activation | Steel and nonferrous metals |
10 | Metal activator | MS Act-100 | Metal material activation | Copper and copper alloy |
11 | Nickel Strike | – | Materials offer | Light metal, copper alloy, STS, Ti |
12 | Electroless nickel | MS EN-811 | Ni-B (1%) | Electronic parts |
13 | Electroless nickel(High Phosphorous) | MS EN-611 | Ni-P (10-14%) | High corrosion resistance, Heavy EN |
14 | Electroless nickel(Mid Phosphorous) | MS EN-411 | Ni-P (8-9%) | Standard Edition, Al undercoat |
15 | Electroless nickel(Mid Phosphorous) | MS EN-211S | Ni-P (8-9%) | Semi Bright |
16 | Electroless nickel(Mid Phosphorous) | MS EN-211 | Ni-P (8-9%) | High Bright |
17 | Electroless nickel(Low Phosphorous) | MS EN-511 | Ni-P (3% ) | For high hardness parts |
18 | Electroless nickel(neutrality pH) | MS EN-NP7 | Ni-P (6-8%) | Middle temperature Electroless nickel |
19 | Electroless nickel Cobalt Alloy | KINKO-207 | Ni-Co-P Alloy | Electronic parts, shielding agent |
20 | Electroless nickel Tungsten Alloy | MS NWL | Ni-P-W Alloy | Chemical device Anticorrosive quality |
21 | Electroless nickel Tungsten Alloy | MS NWM | Ni-P-W Alloy | Anticorrosive quality and Wear resistant |
22 | Sealing | SG-1 | Corrosion inhibition, sealing treatment | Post-plating treatment agent |
23 | Remover | MS Strip-200 | Remover (Two type) | Copper and copper alloy |
Recommended Process
1. Steel and alloys
– Deposition-Electrolysis Cleaning (Top-Clean)
– Activation processing (10%-HCl or MS PA-100)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
* High carbon steel products are anodic degreasing
– Activation processing (10%-HCl or MS PA-100)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
* High carbon steel products are anodic degreasing
2. STS / Inconel
– Deposition-Electrolysis Cleaning (Top-Clean)-Acid Dip (10%-HCl)
– Nickel Strike (Wood bath anodic etching 3-5 ASD 2 min treatment)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
– Nickel Strike (Wood bath anodic etching 3-5 ASD 2 min treatment)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
3. Aluminum and alloys
– Deposition Cleaning (MS-A Clean) – Alkali etching (MS-A22)
– Desmut (MS-A111 Si Desmut)
– Zincate (Non cyanide Zincate MS-Zin22/Ternary alloy Zincate MS-Zin500)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
– Desmut (MS-A111 Si Desmut)
– Zincate (Non cyanide Zincate MS-Zin22/Ternary alloy Zincate MS-Zin500)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
4. Molybdenum material
– Deposition-Electrolysis Cleaning (Top-Clean)
– Alkali activator (MS-Act 500)
– Catalyst treatment agent (MS-PD 200)
– Electroless nickel (MS EN Process)
– Alkali activator (MS-Act 500)
– Catalyst treatment agent (MS-PD 200)
– Electroless nickel (MS EN Process)
5. Copper and copper alloy
– Deposition-Electrolysis Cleaning (Top-Clean)
– Activation processing (10% H2SO4 or MS-PA 100)
– Nickel Strike (Type: Wood improved, Watt, sulfamic acid) or catalytic treatment (MS Act-100)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
– Activation processing (10% H2SO4 or MS-PA 100)
– Nickel Strike (Type: Wood improved, Watt, sulfamic acid) or catalytic treatment (MS Act-100)
– Electroless nickel (MS EN Process)
– Sealing (SG-1)
Instruction manual for each product
Degreasing and pretreatment agent : Top Clean /MS A-Clean /MS A-22/MS Zin-500
Catalyst non-catalytic activator : MS Dd-200/MS Act100/MS Act-500/MS PA-100
Electroless nickel : MS EN Process
Electroless nickel alloy plating : Electroless nickel Cobalt Alloy(KINCO-207), Electroless nickel Tungsten Alloy(MS NW Process)
Sealing : SG-1
Remover : MS Strip 200