Desmear Plating process
Products Application Guidance

A process chemically removing the resin residuals and smear caused during multi-layer-board(MLB) hole drilling of the Printed Circuit Board(PCB)

Person-in-charge

Director. Dong-jin Lee / +86-10-8954-7888 / djlee0117@hanmail.net

No. Process Explanation Chemicals
1 Sweller Swelling for removing mear and increasing adhesion MS-D1000
2 Rinsing
3 Epoxy Etching Micro-Porus function on inner wall of swelled smear removal hole MS-D1100
4 Rinsing
5 Neutralizer Slightly acidic Reducer for neutralization and removal of residual Oxidizer MS-D1200
6 Rinsing
7 Dry