PCB Final Finish ENIG plating process
Products Application Guidance
Lighting device, semiconductor device which one way or forward direction current permitted but not for reverse current and when one-way voltage permitted, emission by reunion of hydrophobic carrier(electron, electron hole) injected under semi-conductors’ P-N voltage structure. Currently widely used for all the signal systems and TV and is expected to widen its usage. MSC handle full process for this item and satisfy RoHS regulations.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
공정순 | 공정명 | 공정 설명 | 추천 약품 |
1 | Acid Clean | MS Clean 32 | |
2 | 수세 | ||
3 | Soft Etching | MS PC-180 | |
4 | 수세 | ||
5 | Acid Dip | ||
6 | 수세 | MS ACT 20/100 | |
7 | Catalyst | ||
8 | 수세 | MS 100/150 | |
9 | E’less Nickel | ||
10 | 수세 | MS Glod M | |
11 | Immersion Gold | ||
12 | 수세 | ||
13 | 건조 |