PCB Final Finish ENIG plating process
Products Application Guidance

Lighting device, semiconductor device which one way or forward direction current permitted but not for reverse current and when one-way voltage permitted, emission by reunion of hydrophobic carrier(electron, electron hole) injected under semi-conductors’ P-N voltage structure. Currently widely used for all the signal systems and TV and is expected to widen its usage. MSC handle full process for this item and satisfy RoHS regulations.

Person-in-charge

Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com

공정순 공정명 공정 설명 추천 약품
1 Acid Clean   MS Clean 32
2 수세
3 Soft Etching   MS PC-180
4 수세
5 Acid Dip
6 수세 MS  ACT 20/100
7 Catalyst  
8 수세 MS 100/150
9 E’less  Nickel  
10 수세 MS Glod M
11 Immersion Gold
12 수세
13 건조