Neutral Sn(Tin) Plating
MS-NT500
Aplication
Chip plating such as MLCC,CR
Characteristic
Lead free neutralized tin solution,suitable for barrel, especially for various chips such as MLCC,CR,etc
1. No use of halogen compound-less corrosion at chip. .
2. Dense plating particles ­ - excellence in solderability and adhesion.
3. Less oxidation by oxygen.
4. Superb throwing power - Less thickness deviation.
5. Quick extinction of bubble - suitable for lots of bubble causing equipment.
6. NaOH type
MS-LSM350
Aplication
Chip plating such as MLCC,CR
Characteristic
Neutralized tin solution,suitable for barrel, especially for various chips such as MLCC,CR,etc.
1. No use of halogen compound - lesscorrosion at chip.
2. Dense plating particle - excellence in solderability and adhesion.
3. Less oxidation by oxygen.
4. Superb throwing power - less thickness deviation.
5. NH4OH Type