Soak Cleaner
MS-CLEAN1000
Aplication
Iron
Characteristic
Excellence in degreasing and durability
Explanatory
Powder
Concentration(g/ℓ)
60-100
Temp(℃)
60-90

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MS-CLEAN500
Aplication
Iron, Copper, Brass
Characteristic
Wide range of removeing foreign substances like finger print / No phosphate-easy waste water treatment.
MS-CLEAN2000
Aplication
Iron, Copper, Brass
Characteristic
1. Wide range of removeing foreign substances like finger print
2. No phosphate-easy waste water treatment.
Explanatory
Powder
Concentration(g/ℓ)
60~100
Temp(℃)
60~80

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MS-CLEAN3000
Aplication
Iron, Copper, Brass
Characteristic
1. Wide range of removeing foreign substances like finger print
2. No phosphate-easy waste water treatment.
Explanatory
Powder
Concentration(g/ℓ)
60~100
Temp(℃)
49~90

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MS-CLEAN5000
Aplication
Pre-treatment for PCB electro Cu plating
Characteristic
Acid cleaner enhancing adhesion
Explanatory
Powder
Concentration(g/ℓ)
30~70
Temp(℃)
50~80

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MS-CLEAN32
Aplication
Copper, PCB
Characteristic
Slightly acid-Easy to remove oxide film and cleaning
Explanatory
Powder
Concentration(g/ℓ)
50~150
Temp(℃)
R.T ~ 50

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MS-CLEAN42
Aplication
Iron, Copper, PCB
Characteristic
Alkali type-Low foaming, easy handling
Explanatory
Powder
Concentration(g/ℓ)
20~70
Temp(℃)
20~70

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MS-CLEAN420
Aplication
Iron, Copper, PCB
Characteristic
Liquid type of MS-CLEAN42
Explanatory
Liquid
Concentration(g/ℓ)
200
Temp(℃)
20~70

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MS-CLEAN
Aplication
Iron, Copper, PCB
Characteristic
Liquid type of MS-CLEAN42
Explanatory
Liquid
Concentration(g/ℓ)
100~200
Temp(℃)
R.T ~ 60

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