Pc, Ion Colloid Catalyst
MS-ACT 100
Aplication
Copper meterial, PCB
Characteristic
Selectively adsongbing Pd on to Copper meterial pattern.
Pd catalyst for PCB, general electroless nickel plating treatment.
Explanatory
Liquid
MSPL SP-PD
Aplication
Plastic, ABS, PC, etc.
Characteristic
Providing catalyst metal core(metal Pd : 1.2g/ℓ) for chemical plating on to non-conductor such as plastic.
Pd catalyst for PCB, general electroless nickel plating treatment.
Explanatory
Liquid
MS SP-PD / MS SP-PD(H)
Aplication
Plastic, ABS, PC, Fabric for EMI
Characteristic
Palldium catalyst for plastic and EMI
By concentration, ODM production, supply available. Metal Pd 6.0g/ℓ, metal Pd 9.0g/ℓ producing.
Explanatory
Liquid
MS-C2300(colloid type)
Aplication
Copper plating PCB/PTH
Characteristic
Sn/Pd colloid adsorption process-Making electroless Copper plating particle be adsorbed on the non-conductor.
Keep acid concentration low to give minimum effect on the impact resistance surface.
Designed to have high activating power for strong adsorption on to Epoxy Resin and Glass Fiber.
Explanatory
Liquid
MS-C3300(ion type)
Aplication
Copper plating PCB/PTH
Characteristic
Adsorbing negative charged Palladium to the in-lay of the hole and copper surface which is positively charged by cation surface agent
Alkali catalyst System-easy control.
Explanatory
Liquid