Electroless Au(Gold) Plating
AUROLESS 211N
Make-up
AUROLESS-211CN : 50㎖/ℓ, PGC : 1.5g/ℓ, D.I Water : 950㎖/ℓ
Characteristic
High speed substitution gold plating for gold plating on neutralized sub-nickel.
Explanatory
Au(g/ℓ)
1g/ℓ(0.5-1.3)
Temp(°C)
80(78-85)
pH
4.5-5.5
㎛/10min
0.05μm / 10min
AUROLESS 05M
Type
AUROLESS 05M-A, B, C, D(4type)
Characteristic
ASubstitution gold plating solution for machine parts.(non-cyan type)
Explanatory
Au(g/ℓ)
1.5~2.5
pH
6.5~7.5
Temp(℃)
70~82
㎛/30min
0.12μm / 10min
AUROLESS 300S-A
Type
AUROLESS 300S-A, B, C, D(4type)
Characteristic
Reduction gold plating solution. Non-cyan type.
Self-activated electroless gold bath, attach thickness possible.
High deposition speed, densic gold plating film.
Usable around neutral pH area, less influence on resist.
Moderate stability of bath, up to 4~5 MTO can be used continuously.
Explanatory
Au(g/ℓ)
1.5~2.5
pH
6.5~9.5
Temp(℃)
70~80
㎛/30min
0.5~0.9
MS-GOLD M
Make-up
MS-GOLD M : 200㎖/ℓ, PGC : 1.5g/ℓ, D.I Water : 800㎖/ℓ
Characteristic
Substitution solution for gold plating on surface of sub-nickel.
Explanatory
Au(g/ℓ)
0.5~1.3
Temp(°C)
4.7
pH
78~88
㎛/10min
0.5