Electoless Cu(Copper) Plating
EC-500
Aplication
EMI Shield
Characteristic
General copper solution suitable for horizontal continuous plating facility for EMI shield,fabric plating
MS-PC75 M
Aplication
PCB
Characteristic
Low speed type electroless copper solution for through hole.
MC- M
Aplication
POP
Characteristic
Electroless copper solution for plastic.
EC-56M
Aplication
EMI Shield
Characteristic
1. Bright pinky film
2. Suitable for pattern plating bath
3. General copper solution suitable for horizontal continuous plating facility for EMI shield,fabric plating
MSMID-70
Aplication
MID
Characteristic
1. Bright pinky film
2. Suitable for pattern plating bath
3. Copper chloride type,high plating speed.
MS-C2500
Aplication
PCB
Characteristic
1. Low speed of electroless copper plating solution for PTH
2. Perfect copper plating coverage,even thickness(0.3~0.5㎛),
3. Evenly conducting plating film
MS-C2600
Aplication
PCB
Characteristic
Highly improved solution for PTH with high purity of concentration stability of working bath, even thickness,easy management.