Electoless Cu(Copper) Plating
EC-500
Aplication
EMI Shield
Characteristic
General copper solution suitable for horizontal continuous plating facility for EMI shield,fabric plating
MS-PC75 M
Aplication
PCB
Characteristic
Low speed type electroless copper solution for through hole.
MC- M
Aplication
POP
Characteristic
Electroless copper solution for plastic.
EC-56M
Aplication
EMI Shield
Characteristic
1. Bright pinky film
2. Suitable for pattern plating bath
3. General copper solution suitable for horizontal continuous plating facility for EMI shield,fabric plating
2. Suitable for pattern plating bath
3. General copper solution suitable for horizontal continuous plating facility for EMI shield,fabric plating
MSMID-70
Aplication
MID
Characteristic
1. Bright pinky film
2. Suitable for pattern plating bath
3. Copper chloride type,high plating speed.
2. Suitable for pattern plating bath
3. Copper chloride type,high plating speed.
MS-C2500
Aplication
PCB
Characteristic
1. Low speed of electroless copper plating solution for PTH
2. Perfect copper plating coverage,even thickness(0.3~0.5㎛),
3. Evenly conducting plating film
2. Perfect copper plating coverage,even thickness(0.3~0.5㎛),
3. Evenly conducting plating film
MS-C2600
Aplication
PCB
Characteristic
Highly improved solution for PTH with high purity of concentration stability of working bath, even thickness,easy management.