Pure Sn, Sn-Pb, Sn-Bi Alloy Plating
MS-HSM
Applications
I/C package and Electronic parts.
Characteristic
1. Lead Free Suitable for Msa bath.
2. Even plating under wide range of current density
3. Suitable additives for pure tin,high-speed, semi-brightness plating
MS-HSB
Applications
Electronic parts,Lead Free
Characteristic
1. Suitable for MSA bath.
2. Even plating under wide range of current density
3. Superb solderability
4. Especially suitable for high speed Reel to Reel plating
MS-H30
Applications
Electronic parts,Wide width plates
Characteristic
1. Lead Free Suitable for Msa bath.
2. Even plating under wide range of current density
3. Suitable additives for pure tin,high-speed, semi-brightness plating
4. Minimize whisker problem.
5. Low carbon concentrated plating
6. Superb solderability.
MS-LSM
Applications
Electronic parts,Pure Tin
Characteristic
1. Applicable to wide range of MSA bath,sulfate bath,etc.
2. Even plating under wide range of current density
3. Designed suitable for barrel and rack plating
4. Suitable for pure tin plating of non or semibrightness
5. Minimize whisker problem.
6. Low carbon concentrated plating
7. Superb solderability
8. Widely used for electronic parts.
MS-LSB
Applications
Electronic parts,general parts.
Characteristic
1. Even plating under wide range of current density
2. Suitable for pure tin plating of brightness
3. Widely used for electronic parts.
4. Suitable for Barrel and Rack plating
MS-MSM
Applications
Electronic parts,Lead Free
Characteristic
1. Applicable to wide range of MSA bath,sulfate bath,etc.
2. Even plating under wide range of current density
3. Designed suitable for barrel and rack plating
4. Suitable for pure Tin plating of semi plating and lead from 97:3 to 60:40
5. Etching resist plating for PCB Pattern method.
MB-HSM
Applications
Electronic parts,Lead Free
Characteristic
1. Suitable for MSA bath.
2. Even plating under wide range of current density
3. Suitable for R-T-R and M-T-M plating
4. Suitable for 98:2 of semi bright Sn and Bi
5. Possible dense grain plating and minimize whisker problem
6. Low carbon concentrated plating
7. Superb solderability
MB-LSB
Applications
Electronic parts,Lead Free
Characteristic
1. suitable for wide range of MSA bath
2. Designed suitable for barrel and rack plating
3. Suitable for bright tin and Bi of 97:3 plating
4. Possible dense grain plating and minimize whisker problem
5. Superb solderability
MB-LSM
Applications
Electronic parts,Lead Free
Characteristic
1. Suitable for MSA bath.
2. Designed suitable for barrel and rack plating
3. Suitable for bright tin and Bi of 97:3 plating
4. Possible dense grain plating and minimize whisker problem
5. Low carbon concentrated plating
6. Superb solderability
MS-TIN100
Applications
Copper or Copper alloy
Characteristic
1. Simple dipping treatment enough for even,dense film
2. Wide range of working temperature and good solderability
3. Non-cyan,non-fluorine type,superb stability
4. Suitable for PCB and COF package
5. MSA type, Immersion tin plating