PCB Special Additive Plating
MS-Pd 300
PCB process-remove Pd smut
1. Able to remove remaining Pd smut by dipping or spray in short time
2. PH:9 slightly alkali.Copper solubility controlled under 0.05㎛
3. Effective for pre-trement of electroless nickel plating on build-up,fine pattern method.
4. MSA salt base,one solution type-easy handling.
5. More effectiveness by treating mixed exclusive acid cleaner.
6. Remover of Pd smut left after copper etching process bred by activator during the plating process on PCB
7. Through this process,other than the pattern any deposition of electroless nickel can be prohibited that highly reliable products expected