Etc. Additive Plating
POWER ACT150(CU)
MS-STRIP AU
Applications
Gold plating on all kind of metals
Characteristic
Stripping Gold or gold alloy from all kind of metal
MS-STRIPPER(BIA)
Applications
Material stripper on Tin and tin/Bismuth alloy plating(alloy material)
Characteristic
1. Suitable for use alloy42
2. Room temperature working
3. No attack at sub-metal
4. No toxic harmful heavy metals.
MS-STRIPPER(BIC)
Applications
Material stripper on Tin and tin/Bismuth alloy plating(Cu material)
Characteristic
1. Suitable for sub-metal like copper.
2. No attack at sub-metal
3. High stripping speed.
4. No toxic harmful heavy metals
MS-STRIPPER(RE)
Applications
Material stripper on Tin and tin/lead alloy plating
Characteristic
1. Compatible with copper and alloy42
2. No corrosiveness under room temperature working
3. No toxic harmful heavy metals
MS-STRIPPER
Applications
Rack/Belt stripper on Tin and tin/lead alloy plating
Characteristic
1. High speed stripping and no attack at rack or belt
2. Long-lasting and easy maintenance as one solution type.
3. Able to strip up to about 250~300g/ℓ of tin concentration of solution
MS-STRIP200
Applications
Electroless nickel stripper on copper and copper alloy
Characteristic
1. Alkali type-electroless nickel strippper on copper and copper alloy
2. Less attack to sub-metal.