Etc. Additive Plating
POWER ACT150(CU)
MS-STRIP AU
Applications
Gold plating on all kind of metals
Characteristic
Stripping Gold or gold alloy from all kind of metal
MS-STRIPPER(BIA)
Applications
Material stripper on Tin and tin/Bismuth alloy plating(alloy material)
Characteristic
1. Suitable for use alloy42
2. Room temperature working
3. No attack at sub-metal
4. No toxic harmful heavy metals.
2. Room temperature working
3. No attack at sub-metal
4. No toxic harmful heavy metals.
MS-STRIPPER(BIC)
Applications
Material stripper on Tin and tin/Bismuth alloy plating(Cu material)
Characteristic
1. Suitable for sub-metal like copper.
2. No attack at sub-metal
3. High stripping speed.
4. No toxic harmful heavy metals
2. No attack at sub-metal
3. High stripping speed.
4. No toxic harmful heavy metals
MS-STRIPPER(RE)
Applications
Material stripper on Tin and tin/lead alloy plating
Characteristic
1. Compatible with copper and alloy42
2. No corrosiveness under room temperature working
3. No toxic harmful heavy metals
2. No corrosiveness under room temperature working
3. No toxic harmful heavy metals
MS-STRIPPER
Applications
Rack/Belt stripper on Tin and tin/lead alloy plating
Characteristic
1. High speed stripping and no attack at rack or belt
2. Long-lasting and easy maintenance as one solution type.
3. Able to strip up to about 250~300g/ℓ of tin concentration of solution
2. Long-lasting and easy maintenance as one solution type.
3. Able to strip up to about 250~300g/ℓ of tin concentration of solution
MS-STRIP200
Applications
Electroless nickel stripper on copper and copper alloy
Characteristic
1. Alkali type-electroless nickel strippper on copper and copper alloy
2. Less attack to sub-metal.
2. Less attack to sub-metal.