Electrolytic Ag(Silver) Plating
MS-AG 100(Pre-dip)
Aplication
pcb and electronic parts
Characteristic
1. Excellence in homogeneity,uniformity of plating film and
2. Applicable to copper and electroless nickel layer substitution of electroless nickel/gold plating on PCB,and
3. Optimum for PCB surface treatment.cost reduction
4. Excellence in bath stability
5. superior adhesion and bonding properties
MS-AG SB 1000
Aplication
Characteristic
-
MS-AG 2000
Aplication
Characteristic
-
MS-SILVER 100
Aplication
Lead frame
Characteristic
1. Low cyan type high speed Ag plating solution for strip and spot auto plating
2. working with the low volume concentration of free cyanide and using only inert anode.