Industrial Plastic(ABS and PC 40%) metalizing MSPL Process
Products Application Guidance
Products group for electro plating purposed metalizing process.Stability and strong sticking power of catalyst MSPL SP-PD may realize constant product quality even at low temperature. After catalyst treatment, it show good compatibility in metallization(electro Ni, electro copper, etc.) works. All products contain Ni MSPL mp-50 satisfy RoHS regulations.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
| No. | Process | Explanation | Chemicals |
| 1 | Cleaning (or High sulfuric acid pre-etching) | ABS Surface adjustment | MS Cleaner |
| 2 | Liquid Removing or Transfer without washing | ||
| 3 | Chromic acid-sulfuric acid etching (Chrome playback device) |
Butadiene release,Etching | MS WA |
| 4 | Drag Back 3 / Rinsing 3 | ||
| 5 | Restoration,Neutralization | Residual hexavalent chromium removal | HCl-H₂O₂ |
| 6 | Rinsing 2 | ||
| 7 | HCl Pre-Dip | Catalyst stabilization | 10%-HCl |
| 8 | Activation Ⅰ | Pd-Sn Colloid catalyst adsorption | MSPL SP-PD |
| 9 | Rinsing 2 | ||
| 10 | Activation Ⅱ | Annotation Removal and Pd Activation | 10%-H₂SO₄ |
| 11 | Rinsing 2 | ||
| 12 | Electroless nickel (Electroless copper) | Metallization of non-conductive resin | MSPL mp-50 |
| 13 | After that / Electroplating |