Indium(In) Plating process of Wafer
Products Application Guidance
Electro Indium(In) plating process providing solution through individual process containing In-base processing
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
Reference
In case of electroless or electro-plating work on pb containing materials causing lead oxide on the parts surface or corrosion due to low current efficiency of plating solution,
– plating sticking failure, discoloration
– low current parts plating failure
| No. | Process | Explanation | Chemicals |
| 1 | Degreasing | MS Top Clean | |
| 2 | Rinsing | ||
| 3 | Activation | ||
| 4 | Rinsing | ||
| 5 | Nickel undercoat | MS 200 S | |
| 6 | Rinsing | ||
| 7 | Strike | MS-IN 200 | |
| 8 | Electroplating | Indium Build Up | MS-IN 200 |
| 9 | Rinsing | ||
| 10 | Dry |