Desmear Plating process
Products Application Guidance
A process chemically removing the resin residuals and smear caused during multi-layer-board(MLB) hole drilling of the Printed Circuit Board(PCB)
Person-in-charge
Director. Dong-jin Lee / +86-10-8954-7888 / djlee0117@hanmail.net
| No. | Process | Explanation | Chemicals |
| 1 | Sweller | Swelling for removing mear and increasing adhesion | MS-D1000 |
| 2 | Rinsing | ||
| 3 | Epoxy Etching | Micro-Porus function on inner wall of swelled smear removal hole | MS-D1100 |
| 4 | Rinsing | ||
| 5 | Neutralizer | Slightly acidic Reducer for neutralization and removal of residual Oxidizer | MS-D1200 |
| 6 | Rinsing | ||
| 7 | Dry |