Electroless plating process on Powder.
Products Application Guidance
Coating Function-requiring metal on ceramic, resin, metal powder, CBN with 1~200 um diameter, It is essential to design the necessary facility for powder plating and know-how of plating process, how-to-manage.
Person-in-charge
Mr. S.H. Roh, GM / 010-7748-0994 / 19hero77@naver.com
| No. | Process | Explanation | Chemicals |
| 1 | Cleaning | MS-Clean | |
| 2 | Rinsing | ||
| 3 | Etching | Classification by material | MS Etching |
| 4 | Rinsing | ||
| 5 | Conditioner | Classification by material | MS Conditioner |
| 6 | Rinsing | ||
| 7 | Sensitizing or activating | MS ACT or SP-PD Process | |
| 8 | Rinsing | ||
| 9 | Accelerator | MS ACT Process | |
| 10 | Rinsing | ||
| 11 | Electroless Plating | Ni-P | MS 211/511 |
| Ni-B | MS 811 | ||
| Ni-P-W | MS ENW | ||
| Ni-P-Co | MS Ni-Co | ||
| Ag | MS Immersion Silver | ||
| Sn | MS Immersion Tin | ||
| Au | MS Auroless | ||
| Cu | MS Cu-550 | ||
| 12 | Rinsing | ||
| 13 | Dry |